View HLMP-SL10-EH0ZZ_3786141.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

hlmp-rd11/sd11/rg10/sg10/rl10/sl10 4 mm super oval precision optical performance alingap leds data sheet features ? f well fdefnedf spatialf radiationf pattern ? f viewing f angle:f f f f f majorfaxisf 120f f f f minorfaxisf60 ? f high fluminousfoutput ? f two f redfandfamberf intensityf levels:f f f alingap f (bright)fandf alingapfiif (brightest) ? f colors:f f f f f 626/630fnmf redf f f f 590/592fnmfamber ? f superior f resistancef tof moisture ? f uv f resistantf epoxy applications ? f full f colorf signs benefts ? f viewing f anglef designed f for f widef feldf off viewf applications ? f superior f performancef forf outdoorf environments description these f precision f opticalf performance f oval f ledsf are f specif - callyf designed f for f full f color/video f andf passenger f informa - tionf signs. f the f oval f shapedf radiation f pattern f (60f xf 120)f andf highf luminousf intensity f ensure f that f thesef devices f are f excellent f for f widef feldf off viewf outdoor f applications f where f af widef viewingf anglef andf readability f inf sunlight f are f essential. f these f lampsf have f very f smooth,f matched f radiation f patterns f ensuring f consistent f color f mixingf inf fullf color f applications, f messagef uniformity f across f thef viewingf anglefoffthef sign. high f efciency f ledf materials f are f usedf inf thesef lamps:f aluminum f indium f gallium f phosphide f (alingap) f for f red f andf amber f color. f there f are f two f familiesf off red f andf amberf lamps, f alingap f andf thef higherf performance f alingap f ii.f eachf lampf isf madef withf anf advanced f opticalf grade f epoxy f ofering f superior f highf temperature f andf highf moisture f resistance f inf outdoor f applications. f the f package f epoxy f contains f bothf uv-a f andf uv-b f inhibitors f to f reduce f thef efects fofflongf termf exposuref tof directf sunlight. designers f canf select f parallel f (where f thef axisf off thef leadsf isf parallel f to f thef widef axisf off thef oval f radiation f pattern) f orf perpendicular f orientation. f both f lampsf are f available f inf tinted f version.
2 package dimensions 4.0 0.20 (0.157 0.008) 1.25 0.20 (0.049 0.008) 0.80 (0.016) max. epoxy meniscus 9.50 0.50 (0.374 0.007) 0.44 0.20 (0.017 0.008) cathode lead a ? 6.30 0.20 (0.248 0.008) 2.54 0.30 (0.100 0.012) 21.0 (0.827) min. 1.0 (0.039) min. 0.40 +0.10 ?0 (0.016 +0.004 ?0.000) 0.45 +0.10 ?0.04 (0.018 +0.004 ?0.002) 4.0 0.20 (0.157 0.008) 1.25 0.20 (0.049 0.008) 0.80 (0.016) max. epoxy meniscus 9.50 0.50 (0.374 0.007) 0.44 0.20 (0.017 0.008) cathode lead b ? 6.30 0.20 (0.248 0.008) 2.54 0.30 (0.100 0.012) 21.0 (0.827) min. 1.0 (0.039) min. 0.40 +0.10 ?0 (0.016 +0.004 ?0.000) 0.45 +0.10 ?0.04 (0.018 +0.004 ?0.002) dimensions are in millimeters (inches).
3 device selection guide for alingap ii color and dominant luminous intensity wavelength i v (mcd) at 20 ma leads with leadframe package part number d (nm) typ. min. max. stand-ofs orientation drawing hlmp-rd11-j0000f red f630f 240fffffffffffff f -f f yesf parallelf b hlmp-rd11-lp0xxf red f630f 40f 1150f yesf parallelf b hlmp-rd11-lptxxf red f630f 400 ffffffffffffff 1150f yesf parallelf b hlmp-sd11-j0000f red f630f 240fffffffffffff f -f yesf perpendicularf a hlmp-sd11-lp000f red f630f 400fffffffffffff f 1150f yesf perpendicularf a hlmp-sd11-lptxxf red f630f 400fffffffffffff f 1150f yesf perpendicularf a hlmp-sd11-mn0xxf red f630f 520fffffffffffff f 880f yesf perpendicularf a hlmp-sd11-mntxxf red f630f 520fffffffffffff f 880f yesf perpendicularf a notes: 1.f the fluminousf intensityfisf measuredfonfthefmechanicalfaxisfofftheflampf package. 2.f the fopticalfaxisfisfcloselyf alignedfwithfthef packagefmechanicalf axis. 3.f f thef dominantf wavelength,f d ,fisf derivedf fromfthefcief chromaticityf diagramfandf representsfthef colorfoffthef lamp. f device selection guide for alingap part number color and dominant wavelength d (nm) typ. luminous intensity iv (mcd) at 20 ma leads with stand-of leadframe orientation package drawing min. max. hlmp-sg10-jm0xx red f626 240 680 yes perpendicular a hlmp-rg10-jm000 red f626 240 680 yes parallel b hlmp-sl10-hl0dd amber f590 180 520 yes perpendicular a hlmp-sl10-lm0dd amber f590 400 680 yes perpendicular a hlmp-sl10-lmkdd amber f590 400 680 yes perpendicular a hlmp-sl10-lmldd amber f590 400 680 yes perpendicular a hlmp-sl10-lp0xx amber f590 400 1150 yes perpendicular a hlmp-sl10-lpkdd amber f590 400 1150 yes perpendicular a hlmp-sl10-mnkxx amber f590 520 880 yes perpendicular a hlmp-sl10-mp0dd amber f590 520 1150 yes perpendicular a hlmp-sl10-mq0dd amber f590 520 1500 yes perpendicular a hlmp-sl10-mqldd amber f590 520 1500 yes perpendicular a hlmp-rl10-lmldd amber f590 400 680 yes parallel b hlmp-rl10-lp0xx amber f590 400 1150 yes parallel b hlmp-rl10-mp0dd amber f590 520 1150 yes parallel b hlmp-rl10-mqldd amber f590 520 1500 yes parallel b notes: 1.f the fluminousf intensityfisf measuredfonfthefmechanicalfaxisfofftheflampf package. 2.f the fopticalfaxisfisfcloselyf alignedfwithfthef packagefmechanicalf axis. 3.f f thef dominantf wavelength,f d ,fisf derivedf fromfthefcief chromaticityf diagramfandf representsfthef colorfoffthef lamp.
4 absolute maximum ratings t a f=f25c parameter amber and red dcf forwardf current 1 fffff 50fma peak f pulsedf forwardf currentff 100fma average f forwardf currentfff 30fma reverse f voltage f(i r f=f100f a)f 5f v power f dissipationf 120fmw ledf junctionf temperaturef 130c operating f temperature f rangef C40cf tof+100c storage f temperature f rangef C40cf tof+100c note: 1.f f deratef linearlyfasf shownfinf figuresf4. part numbering system mechanical options 00:fbulkf packaging dd:f ammof pack yy: f flexi-bin;fbulkf packaging zz:f flexi-bin;f ammof pack color bin & v f selections 0:fnof colorfbinf limitation f t: f redf colorfwithf v f f maximumfoff2.6f v k: f amberf colorfbinsf2fandf4 l:f amberf colorf binsf4fandf6 maximum intensity bin 0:fnof ivfbinf limitation minimum intensity bin refer to device selection guide color d:f630fnmf red g:f626fnmf red l:f590fnmf amber package r:f4fmmf60fxf 120oval,f parallel s:f4fmmf60fxf 120oval,f perpendicular hlmpf -f xf xf xxf -f xf xf xf xx
5 electrical/optical characteristics t a f=f25c parameter symbol min. typ. max. units test conditions typical f viewing f angle [1] f 2 ? f f f f degf f f f f ff majorf f f 120f f f f f f f ff minorf f f 60 forward f voltagef v f f f f f vf i f f=f20fma f ff redf( d f=f626fnm)f f f 1.9f 2.4f f f ff redf( d f=f630fnm)f f f 2.0f 2.4 [2] f f ff amberf( d f=f590fnm)f f f 2.02f 2.4 reverse f voltagef v r f f f f vf i r f=f100f af f f ff amberfandf redf f 5f 20f f f f f peak f wavelengthf peak f f f f nmf peak foff wavelength fof f ff redf( d f=f626fnm)f f f 635f f f spectral f distribution f ff redf( d f=f630fnm)f f f 639f f f at fi f f=f20fma f ff amberf( d f=f590fnm)f f f 592f f f f f f spectral fhalfwidthf ? ? f f f f nmf wavelength f width f at f ff redf( d f=f626/630fnm)f f f 17f f f spectral f distributionf f ff amberf( d f=f590fnm)f f f 17f f f ?f powerf pointf atfi f f=f20fma capacitancef cf f f f pff v f f=f0,fff=f1f mhzf f ff allf colorsf f f 40 thermal f resistancef r j-pin f f f f c/wf led f junction-to-cathode f ff allf colorsf f f 240f f f lead luminous f efcacy [3]f vf f f f lm/wf emitted f luminousf power/ f ff redf( d f=f626fnm)f f f 150f f f emitted f radiantf power f ff redf( d f=f630fnm)f f f 155f f f f ff amberf( d f=f590fnm)f f f 480f f f f f f notes: 1.ff f 2 ? fisfthefof-axisfanglef wherefthefluminousf intensityfisfthefon-axisf intensity. 2.ff f forfoptionsf-xxrxx,f -xxtxx,fandf-xxvxx,fmaximumf forwardf voltage,f v f ,fisf2.6f v. f pleasef referf tof v f fbinf table f below.f ff 3.f f thef radiant f intensity, f i e ,f inf watts f perf steradian, f may f bef found f from f thef equation f i e f =f i v / v ,f where f i v f isf thef luminousf intensity f inf candelasf andf v f isf thefluminousf efcacyfinf lumens/watt.
6 figure 4. amber, red maximum forward current vs. ambient temperature. figure 1. relative intensity vs. wavelength. figure 2. amber, red forward current vs. forward voltage. figure 3. amber, red relative luminous intensity vs. forward current. 0 4 0 2 0 i f ? f o r w a r d c u r r e n t ? m a v f ? f o r w a r d v o l t a g e ? v 1 . 0 3 . 0 a m b e r 1 . 5 2 . 0 2 . 5 1 0 3 0 5 0 r e d r e l a t i v e l u m i n o u s i n t e n s i t y ( n o r m a l i z e d a t 2 0 m a ) 0 0 i f ? f o r w a r d c u r r e n t ? m a 2 0 4 0 2 . 0 1 . 0 5 0 0 . 5 1 . 5 2 . 5 3 0 1 0 i f ? f o r w a r d c u r r e n t ? m a 0 0 t a ? a m b i e n t t e m p e r a t u r e ? c 4 0 8 0 5 0 4 0 3 0 2 0 1 0 2 0 6 0 1 0 0 r j - a = 5 8 5 c / w 6 0 r j - a = 7 8 0 c / w 1 2 0 0 0 . 1 0 . 2 0 . 3 0 . 4 0 . 5 0 . 6 0 . 7 0 . 8 0 . 9 1 5 0 0 5 5 0 6 0 0 6 5 0 7 0 0 w a v e l e n g t h - n m r e l a t i v e i n t e n s i t y r e d a m b e r figure 5b. representative spatial radiation pattern for minor axis. figure 5a. representative spatial radiation pattern for major axis. rela tive intensi ty 1.0 0 angular displa cement ? degrees 0.8 0.6 0.2 -90 0.4 -60 0 -30 15 45 90 -45 -15 30 60 -75 75 rela tive intensi ty 1.0 0 angular displa cement ? degrees 0.8 0.6 0.2 -90 0.4 -60 0 -30 15 45 90 -45 -15 30 60 -75 75
7 intensity bin limits (mcd f atf20f ma) bin name min. max. hf 180f 240 jf 240f 310 kf 310f 400 lf 400f 520 mf 520f 680 nf 680f 880 pf 880f 1150 tolerance f forfeachfbinflimitfisff15%. vf bin table 2 bin name min. max. f vaf 2.0f 2.2 f vbf 2.2f 2.4 f vcf 2.4f 2.6 tolerance f forfeachfbinfisf0.05f v. note: 1.f f binf categories f are f establishedf for f classifcation f off products. f products f may fnotfbef availablefinfallfbinf categories. 2.f vf fbinningfisfapplicablef forf partfnumbersfwithfoptionf -xxtxx. note: 1.f all f binf categories f are f establishedf for f classifcation f off products. f products f may f notf bef available f inf allf binf categories. f please f contact f your f avagof representa tives f forf furtherf information. color bin limits (nmf atf20f ma) amber colour range (nm) bin id min. max. f 1f 584.5f 587.0 f 2f 587.0f 589.5 f 4f 589.5f 592.0 f 6f 592.0f 594.5 tolerance f forfeachfbinflimitfisf0.5fnm.
8 precautions: lead forming: ? f the f leadsf off anf ledf lampf may f bef preformed f orf cutf to f lengthf priorf tof insertionfandf solderingfonfpcf board. ? f for f better f control, f itf isf recommended f to f usef proper f tool f to f precisely f form f andf cutf thef leadsf to f applicablef lengthf ratherfthanfdoingfitf manually. ? f if f manualf leadf cuttingf isf necessary, f cutf thef leadsf after f thef soldering f process. f the f solderf connection f forms f af mechanicalf ground f whichf prevents f mechanicalf stress f duef to f leadf cuttingf from f traveling f into f ledf package. f this f isf highlyf recommended f for f handf solderf operation, f asfthef excessfleadflengthfalsof actsfasfsmallf heatf sink. soldering and handling: ? f care f mustf bef takenf during f pcbf assemblyf andf soldering f process f tof preventfdamagef tofthefledf component.f ? f led f component f may f bef efectively f handf soldered f to f pcb. f however, f itf isf onlyf recommended f underf unavoidable f circumstances f suchf asf rework. f the f closestf manualf soldering f distance f off thef soldering f heat f source f (soldering f irons f tip) f to f thef bodyf isf 1.59mm.f soldering f thef ledf usingf soldering f iron f tipf closerf thanf 1.59mmf might fdamagefthef led. note: f 1.f pcb f withf diferent f size f andf design f (component f density) f willf have f diferent f heat f massf (heat f capacity). f this f might f causef af changef inf temperature f experienced f by f thef board f iff samef wave f soldering f settingf isf used. f so, f itf isf recommended f to f re-calibrate f thef soldering f profle fagainf beforefloadingfafnewf typefoff pcb. 2.f avago f technologies f highf brightness f ledf are f usingf highf efciency f ledf dief withf singlef wire f bondf asf shown f below. f customer f isf advisedf to f takef extra f precaution f during f wave f soldering f to f ensure f that f thef maximumf wave f temperature f doesf notf exceed f 250cf andf thef solderf contact f timef doesf notf exceeding f 3sec. f over-stressing f thef ledf during f soldering f process f might f causef premature f failure f to f thef ledf duef to f delamination. avago technologies led confguration 1.59mm ? f esd f precaution f mustf bef properly f appliedf onf thef soldering f station f andf personnelf to f prevent f esdf damagef to f thef ledf component f that f isf esdf sensitive. f do f refer f to f avago f application f note f anf 1142f for f details. f the f soldering f iron f usedf shouldf have f grounded f tipf to f ensure f electrostaticf chargefisf properlyf grounded. ? f recommended f solderingf condition: wave soldering [1, 2] manual solder dipping pre-heat f temperature 105fcf max. - preheat ftime 60fsecf max - peak f temperature 250fcf max. 260fcf max. dwell ftime 3fsecf max. 5fsecf max note: f 1)f above f conditions f refers f to f measurement f withf thermocouple f mounted f atfthef bottomfoff pcb. 2)f it f isf recommended f to f usef onlyf bottom f preheaters f inf order f to f reduce f thermal f stressf experiencedf byf led. ? f wave f soldering f parameters f mustf bef setf andf maintained f according f to f thef recommended f temperature f andf dwell f time. f customer f isf advisedf to f perform f dailyf checkf onf thef soldering f profle f to f ensure f that f itf isf always f conforming f to f recommendedf solderingf conditions. f note: f electrical f connection f between f bottom f surface f off ledf dief andf thefleadf framefisf achievedf throughf conductivef paste. ? f any f alignment f fxture f that f isf beingf appliedf during f wave f soldering f shouldf bef looselyf ftted f andf shouldf notf applyf weight f orf force f onf led. f nonf metalf material f isf recommended f asf itf willf absorb f lessf heat f during f wave f soldering f process. ? f at f elevated f temperature, f ledf isf more f susceptible f to f mechanicalf stress. f therefore, f pcbf mustf allowed f to f cool f down f to f room f temperature f prior f to f handling, f whichf includesf removalfoff alignmentf fxtureforf pallet. ? f if f pcbf board f contains f bothf through f holef (th) f ledf andf otherf surface f mount f components, f itf isf recommended f that f surface f mount f components f bef soldered f onf thef top f sidef off thef pcb. f if f surface f mount f needf to f bef onf thef bottom f side, f thesef components f shouldf bef soldered f usingf refowf solderingf priorf tof insertionfthef thf led. ? f recommended f pcf board f plated f through f holesf (pth)f size f forfledf componentf leads. led component lead size diagonal plated through hole diameter 0.45fxf0.45fmm (0.018xf0.018finch) 0.636fmm (0.025finch) 0.98f tof1.08fmm (0.039f tof0.043finch) 0.50fxf0.50fmm (0.020xf0.020finch) 0.707fmm (0.028finch) 1.05f tof1.15fmm (0.041f tof0.045finch) ? f over-sizing f thef pthf canf leadf to f twisted f ledf after f clinching. f onf thef otherf handf underf sizingf thef pthf canf causef difcultyf insertingfthef thf led. allngap device cathode
9 example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. refer f to f application f note f an5334f for f more f information f aboutf soldering f andf handlingf off highf brightness f thf ledf lamps. note: f the f ammo-packsf drawingfisfapplicablef forf packagingfoptionfCddf&f-zzfandf regardlessfstandofforfnon-standof ammo packs drawing 6 . 3 5 1 . 3 0 0 . 2 5 0 . 0 5 1 2 9 . 1 2 5 0 . 6 2 5 0 . 3 5 9 3 0 . 0 2 5 1 8 . 0 0 0 . 5 0 0 . 7 0 8 7 0 . 0 1 9 7 1 2 . 7 0 0 . 3 0 0 . 5 0 0 . 0 1 1 8 2 0 . 5 1 . 0 0 0 . 8 0 7 1 0 . 0 3 9 4 1 2 . 7 0 1 . 0 0 0 . 5 0 0 . 0 3 9 4 c a t h o d e v i e w a - a 0 . 7 0 0 . 2 0 0 . 2 7 6 0 . 0 0 7 9 4 . 0 0 0 . 2 0 0 . 1 5 7 5 0 . 0 0 7 9 ? t y p .
10 packaging label (i)f avago f motherflabel:f (availablefonf packagingf boxfoffammofpackfandfshippingf box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l note: f forf inganf device,fthefammofpackf packagingf boxf containfesdflogo packaging box for ammo packs
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies. all rights reserved. obsoletes 5989-4174en av02-1544en - september 18, 2008 acronyms and defnition: bin:f (i)f color fbinfonlyforf vffbinfonly f (applicable f for f part f numberf withf color f binsf butf withoutf vffbinforf partfnumberfwithf vffbinsfandfnof colorfbin) orfffffffff (ii)fcolor fbinf incorporatedfwithf vffbin f (applicable f for f part f numberf that f have f bothf color f binf andf vffbin) (ii)favago f babyflabelf (onlyf availablefonfbulkf packaging) example: (i)f color fbinfonlyforf vffbinfonly f bin: f2f (representf colorfbinf2fonly) f bin: f vbf (representf vffbinf vb fonly) (ii)fcolor fbinf incorporatefwithf vffbin f bin: f2vbff f f vb:f vffbinf vb f f 2:ff colorfbinf2fonly disclaimer avagos f products f andf software f aref not f specifically f designed, f manufactured f orf authorized f forf salef asf parts, f components f orf assembliesf forf thef planning,f construction, f maintenance f orf direct f operation f off af nuclearf facility f orf forf usef inf medical f devices f orf applications. ff customer f isf solely f responsible, f andf waives f allf rights f to f make f claimsf against f avago f orf its f suppliers,f forf allf loss, f damage, fexpenseforf liabilityfinf connectionf withfsuchf use. ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n : ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d : d e p t i d : m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n ( 9 d ) d a t e c o d e : d a t e c o d e s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c ( 1 p ) p a r t # : p a r t n u m b e r ( 1 t ) l o t # : l o t n u m b e r ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 3 m a x t e m p 2 5 0 c l a m p s b a b y l a b e l

▲Up To Search▲

Price & Availability of HLMP-SL10-EH0ZZ

	To Download HLMP-SL10-EH0ZZ Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .